Patent Number 5,518,964 (and related Patents) for making flexible electrically conducting element(s), joining said elements to electrical contact(s) on a Substrate terminals of the IC package, including: (i) any method or result of U.S. Wherein said units are stacked one above the other so that at least some of the terminals on mutually adjacent units in the stack are aligned with one another, mutually adjacent units being electrically interconnected to one another by joiningĬonnectors formed at least in part from material bonded to the aligned terminals of such units.Īs used herein means any method, process, technique or Tessera Patent that covers any structures or processing methods for simultaneously forming, producing and/or connecting a plurality of electrical connections between contacts on an IC device and The term Package Stack means an IC package including two or more Package Stack Units, IC device on the package substrate and electrically connected to at least some of the terminals, and The term Package Stack Unit means a package substrate having electrically conductive terminals and at least one The term Multiple Substrate Licensed Product means a Package Stack Unit and a Package Stack, defined respectively ![]() If a Licensed Product contains both a DRAM Device and an IC that is not a DRAM Device, the Licensed Product shall be considered a Non-DRAM Licensed Product.Į. The term Non-DRAM Licensed Product means a Licensed Product that contains at least The term ∽RAM Licensed Product means a Licensed Product that contains at least one IC that is a DRAM Device and does notĭ. Products include DRAM Licensed Products, Non-DRAM Licensed Products and Multiple Substrate Licensed Products.ĭevice means a Dynamic Random Access Memory (DRAM) IC device comprised solely of an array of DRAM cells and the associated control and I/O circuitry that are necessary to allow data to be written to, stored by, and read from the DRAM cells.Ĭ. By way of clarification and not limitation, Licensed Solder balls under the IC (c) die attach adhesive attaching the IC to the polyimide or glass-epoxy or glass-laminate substrate and (d) solder ball pitch less than or equal to 1.0mm. The term Licensed Product includes IC packages using (a) polyimide or glass-epoxy or glass-laminate substrate (b) one or more As used herein, the following terms shall have the following meaning:Ī. Wishes to license the Tessera patents for certain semiconductor products in accordance with the terms hereof. ![]() WHEREAS, Tessera owns certain patents related to semiconductor integrated circuit (IC) packaging technology, and Infineon TCC License Agreement, by and between Tessera and InfineonĪgreement is entered into as of this First day of July, 2006 (∾ffective Date), between TESSERA INC., a corporation organized under the laws of Delaware, having a principal place of business at 3099 Orchard Drive, San Jose, CA, 95134, USAĪnd the Tessera Affiliates (Tessera) and Infineon Technologies AG, a corporation organized under the laws of Germany having a principal place of business at Munich, Germany and the Licensee Affiliates (Licensee) with
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